MICROEMBOSSER L 450 / L 800
Point to point microembosser unit with technology “Point to point without glue”; the system, installed on board of our folding machines, embosses the single plies of paper separately one from the other and carries out the following rebonding of the plies without the use of glue for the bonding.The result is a microembossed product of high quality, with the plies perfectly bonded without the use of glue and with characteristics of high volume and absorbance.
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CHARACTERISTICS
• Microembossing pattern
• Installed on board of our folding machines
• Special position of the unit, placed after the printing station
• Better print quality (web is printed before embossing)
• Unique! Bonding of the plies without glue
• Easy conduction of the embosser
• Available in the models:
- L 450 with width 500 mm
- L 800 with width 850 mm
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